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Custom High-Frequency Stamped Grounding Fingers for 5G Base Stations – Complex Spring Forms

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Custom High-Frequency Stamped Grounding Fingers for 5G Base Stations – Complex Spring Forms

Model Number : TF-001

Compression Range : 0.5-2.0mm / 2.0-4.0mm

MOQ : 1

Delivery Time : 3days/Start

Shielding Effectiveness : 60-90dB / 90dB+

Process Type : Precision Progressive Die Stamping / Complex Spring Arm Forming / Stress Relief Heat Treatment / Non-Standard Customization

Packaging Details : Carton packaging 18*15*12cm (packaging can be customized according to customer product requirements)

Payment Terms : T/T

Main Material : Beryllium Copper C17200 / Beryllium Copper C17510 / Tin-Plated Steel

Surface Finish : Tin Plating / Gold Plating / Nickel Plating

Certification : lSO9001

Brand Name : TF

Operating Frequency : ≤6GHz / ≤28GHz / ≤39GHz

Place of Origin : Shenzhen, China

Price : 0.07-0.23USD

Material Thickness : 0.08-0.12mm / 0.12-0.18mm / 0.18-0.25mm

Supply Ability : 10000000pieces/per month

Product Type : Custom Antenna Grounding Fingers / Complex Form RF Module Shielding Springs / Massive MIMO Contacts

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Custom High-Frequency Stamped Grounding Fingers for 5G Base Stations

Tingfeng Hardware provides custom grounding fingers for 5G Massive MIMO antennas, specializing in complex spring forms. Manufactured from BeCu C17200 with 60–90 dB shielding effectiveness, a 0.5–4.0 mm compression range, and stress relief heat treatment for stable contact force under outdoor thermal cycling. With 16 years of precision manufacturing experience, we help telecom equipment clients address long-term outdoor deployment reliability challenges and the consistency requirements of large-scale antenna arrays.

Product Overview

5G AAUs contain dozens to hundreds of densely packed RF channels, each requiring reliable low-impedance grounding to suppress inter-channel interference. Our BeCu grounding fingers feature complex spring form designs, conductivity of approximately 22% IACS, multi-contact redundancy that reduces single-point failure risk, and stress relief heat treatment that prevents stress relaxation under -40°C to +85°C outdoor cycling. On the commercial side, 5G deployment is shifting from "coverage first" to "O&M efficiency and long-term reliability first." Clients need grounding solutions that maintain performance consistency over years of outdoor service and reduce field maintenance needs. Our full-batch force testing and material traceability system respond directly to this requirement.

Custom High-Frequency Stamped Grounding Fingers for 5G Base Stations – Complex Spring Forms
Features & Advantages
FeatureAdvantage to You
Complex spring form customizationGrounding finger shape customized to antenna element layout, maximizing space utilization
BeCu ≥22% IACS high conductivityLow-impedance grounding for mmWave bands, reducing signal loss
Stress relief heat treatmentStable contact force under -40°C to +85°C outdoor cycling, reducing stress relaxation
0.5–4.0 mm wide compressionAccommodates various assembly gaps between antenna elements and RF modules
Full-batch force testingConsistency assurance for large-scale arrays, reducing field O&M pressure
Custom High-Frequency Stamped Grounding Fingers for 5G Base Stations – Complex Spring Forms
Product Specifications
Specification ItemDetail / RangeTolerance / Standard
Material TypeBeryllium Copper C17200Conductivity ≥22% IACS
Material Thickness0.08 mm – 0.25 mm±0.005 mm
Contact Force0.3 N – 2.0 N±15%
Compression Range0.5 mm – 4.0 mmDesign dependent
Shielding Effectiveness60 – 90 dBDesign dependent
Surface FinishTin / Gold / Nickel PlatingThickness controlled
Operating Temperature-40°C – +85°COutdoor Grade
Salt Spray Test≥ 96 hoursNo corrosion
Custom High-Frequency Stamped Grounding Fingers for 5G Base Stations – Complex Spring Forms
Product Applications
5G Massive MIMO

AAU antenna element grounding fingers and RF channel shielding contacts.

Base Station RF

Filter shielding springs and power amplifier grounding contacts.

Millimeter-Wave Antennas

28 GHz / 39 GHz antenna element grounding and phased array module shielding springs.

Communication Equipment

Base station radome grounding fingers and remote radio unit contacts.

Frequently Asked Questions

Can you handle complex custom designs and provide design optimization suggestions?

Absolutely. This is our core expertise. We provide free DFM analysis within 3–5 days, often helping clients achieve 15–30% cost reduction through design for manufacturability.

How do you ensure quality consistency and handle defect issues?

We implement a rigorous 4-stage QC system with 100% full inspection. Our track record shows a 99.99% qualification rate.

What are your lead times and how do you handle urgent orders?

Standard lead times: 3–7 days for prototypes and 7–15 days for mass production. We offer VIP prioritization that cuts lead times by up to 30%.

Will I get timely responses and professional support throughout the project?

Yes. You get a 1-on-1 exclusive consultant with a 1-hour initial response commitment and 24-hour technical support.

Can you provide material certifications and environmental compliance reports?

Yes. We provide material certifications and environmental test reports (RoHS, REACH compliant) upon request.

How do you protect my designs and intellectual property?

We start with a mutual NDA and implement strict mold ownership protection and confidential data security measures.

What are your payment terms and MOQ requirements?

We offer flexible payment terms (T/T, L/C at sight) and MOQ from 1 piece for prototyping.


Product Tags:

Custom Stamped Grounding Fingers

      

5G Base Station Grounding Fingers

      

Complex Spring Precision Stamping Parts

      
Quality Custom High-Frequency Stamped Grounding Fingers for 5G Base Stations – Complex Spring Forms for sale

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